Disco Corporation
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Companywww.disco.co.jp
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters.
- CEO
- Kazuma Sekiya
- IPO
- 2009
- Employees
- 4,886
- HQ
- Tokyo, JP
Price Chart
Valuation
- Market Cap
- $42.36B
- P/E
- 53.26
- P/S
- 16.52
- P/B
- 12.28
- EV/EBITDA
- 35.36
- Div Yield
- 0.76%
Profitability
- Gross Margin
- 69.98%
- Op Margin
- 42.17%
- Net Margin
- 31.02%
- ROE
- 25.43%
- ROIC
- 23.08%
Growth & Income
- Revenue
- $439.64B · 11.78%
- Net Income
- $136.38B · 10.08%
- EPS
- $1257.47 · 9.99%
- Op Income
- $185.17B
- FCF YoY
- 84.00%
Performance & Tape
- 52W High
- $528.77
- 52W Low
- $181.00
- 50D MA
- $439.53
- 200D MA
- $366.22
- Beta
- 1.07
- Avg Volume
- 646
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