Disco Corporation
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About the company
Disco Corporation specializes in the global production and distribution of advanced machinery for precision cutting, grinding, and polishing applications. Its product portfolio encompasses a wide array of specialized equipment, such as dicing saws, laser saws, grinders, and polishers. It also offers wafer mounters, die separators, surface planers, and waterjet saws, alongside solutions for pre-grinding dicing and package singulation.
- CEO
- Kazuma Sekiya
- IPO
- 2009
- Employees
- 4,886
- HQ
- Tokyo, JP
Price Chart
- Market Cap
- $49.38B
- P/E
- 61.28
- P/S
- 19.02
- P/B
- 14.13
- EV/EBITDA
- 40.93
- Div Yield
- 0.66%
- Gross Margin
- 69.98%
- Op Margin
- 42.17%
- Net Margin
- 31.02%
- ROE
- 25.43%
- ROIC
- 23.08%
- Revenue
- $439.64B · 11.78%
- Net Income
- $136.38B · 10.08%
- EPS
- $1257.47 · 9.99%
- Op Income
- $185.17B
- FCF YoY
- 84.00%
- 52W High
- $573.49
- 52W Low
- $181.00
- 50D MA
- $459.20
- 200D MA
- $393.88
- Beta
- 1.05
- Avg Volume
- 853
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